Invention Grant
- Patent Title: Acoustic wave device, duplexer, communication module, communication apparatus, and manufacturing method for acoustic wave device
- Patent Title (中): 声波装置,双工器,通信模块,通信装置和声波装置的制造方法
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Application No.: US12608397Application Date: 2009-10-29
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Publication No.: US08258891B2Publication Date: 2012-09-04
- Inventor: Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
- Applicant: Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2009-046294 20090227
- Main IPC: H03H9/25
- IPC: H03H9/25 ; H03H9/15 ; H03H9/70 ; H03H9/72 ; H03H3/02 ; H03H3/08 ; H03H3/04 ; H03H3/10

Abstract:
An acoustic wave device includes a piezoelectric substrate, interdigital electrodes arranged on the piezoelectric substrate, a first dielectric element arranged between the interdigital electrodes, a second dielectric element that covers the interdigital electrodes and the first dielectric element, and an adjustment element that has been formed on the first dielectric element. The adjustment element has been formed from a material whose specific gravity is greater than that of the first dielectric element and that of the second dielectric element.
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