发明授权
- 专利标题： Slider bond pad with a recessed channel
- 专利标题（中）： 带凹槽的滑块接合垫
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申请号： US12489176申请日： 2009-06-22
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公开(公告)号： US08259415B2公开(公告)日： 2012-09-04
- 发明人: Erik Jon Hutchinson , Christopher Michael Unger
- 申请人： Erik Jon Hutchinson , Christopher Michael Unger
- 申请人地址： US CA Cupertino
- 专利权人： Seagate Technology LLC
- 当前专利权人： Seagate Technology LLC
- 当前专利权人地址： US CA Cupertino
- 代理机构： Fredrikson & Byron, P.A.
- 主分类号： G11B5/48
- IPC分类号： G11B5/48
摘要：
A slider includes a slider body and a bond pad. The bond pad is positioned on the slider body and has a bonding surface with a recessed channel for directing solder flow. Separately related, an assembly includes a suspension assembly including a suspension mounting surface and a suspension pad on the suspension mounting surface. A slider is positioned adjacent the suspension mounting surface, with a slider pad aligned with the suspension pad. A recessed channel is in at least one of the slider pad or the suspension pad. A solder joint is formed between the suspension pad and the slider pad and extends into the recessed channel.
公开/授权文献
- US20100321829A1 SLIDER BOND PAD WITH A RECESSED CHANNEL 公开/授权日：2010-12-23