发明授权
- 专利标题: Micro piezoresistive pressure sensor and manufacturing method thereof
- 专利标题(中): 微压阻式压力传感器及其制造方法
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申请号: US12745745申请日: 2008-04-21
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公开(公告)号: US08261617B2公开(公告)日: 2012-09-11
- 发明人: Chang Auck Choi , Chang Han Je , Gunn Hwang , Youn Tae Kim , Sung Hae Jung , Myung Lae Lee , Sung Sik Lee , Seok Hwan Moon
- 申请人: Chang Auck Choi , Chang Han Je , Gunn Hwang , Youn Tae Kim , Sung Hae Jung , Myung Lae Lee , Sung Sik Lee , Seok Hwan Moon
- 申请人地址: KR Daejeon
- 专利权人: Electronics and Telecomunications Research Institute
- 当前专利权人: Electronics and Telecomunications Research Institute
- 当前专利权人地址: KR Daejeon
- 优先权: KR10-2007-0125467 20071205
- 国际申请: PCT/KR2008/002233 WO 20080421
- 国际公布: WO2009/072704 WO 20090611
- 主分类号: G01L9/06
- IPC分类号: G01L9/06 ; B23P17/04
摘要:
A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.
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