Invention Grant
- Patent Title: Attachment system and dispensers used therewith
- Patent Title (中): 使用的附件系统和分配器
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Application No.: US11775276Application Date: 2007-07-10
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Publication No.: US08261937B2Publication Date: 2012-09-11
- Inventor: Douglas P. Bodziak , James E. Nash , Peter Newbould , Timothy J. O'Leary , David C. Windorski
- Applicant: Douglas P. Bodziak , James E. Nash , Peter Newbould , Timothy J. O'Leary , David C. Windorski
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Yen Tong Florczak
- Main IPC: A47K10/24
- IPC: A47K10/24 ; B65H1/00 ; B32B9/00 ; B32B33/00

Abstract:
A dispenser includes an upper member having a slot and a lower member attached to the upper member thereby forming a housing, the lower member having an outer surface; a stack of sheets assembled in a fan-fold configuration disposed in the housing; and a polymeric holding film having a first surface attached to the outer surface of the lower member. The holding film having a flexural modulus less than about 50 MPa, as measured according to ASTMD790 standard, and a roughness parameter, Ra of less than about 1 micrometer, as calculated according to ASME B46.1 standard.
Public/Granted literature
- US20080011626A1 ATTACHMENT SYSTEM AND DISPENSERS USED THEREWITH Public/Granted day:2008-01-17
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