Invention Grant
- Patent Title: Manufacturing method for liquid ejecting head unit, and liquid ejecting apparatus
- Patent Title (中): 液体喷射头单元的制造方法和液体喷射装置
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Application No.: US12778698Application Date: 2010-05-12
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Publication No.: US08262197B2Publication Date: 2012-09-11
- Inventor: Hiroyuki Hagiwara , Shunsuke Watanabe
- Applicant: Hiroyuki Hagiwara , Shunsuke Watanabe
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2009-119117 20090515
- Main IPC: B41J2/15
- IPC: B41J2/15 ; B41J2/145

Abstract:
A liquid ejecting head unit includes liquid ejecting heads, each having a row of nozzles that eject liquid. The liquid ejecting heads are anchored to a base plate. An anchoring plate is anchored to the base plate and positions the liquid ejecting heads relative to the base plate. A reference mark is formed in the anchoring plate and a positioning mark is formed in the base plate for positioning the anchoring plate relative to the base plate. The positioning marks are formed along the direction in which the nozzles are arranged in a row. A related manufacturing method includes selecting the positioning mark in accordance with a predetermined resolution and anchoring the anchoring plate to the base plate so that the reference mark and the selected positioning mark are in the same relative positional relationship. The liquid ejecting heads are anchored to the base plate using the anchoring plate.
Public/Granted literature
- US20100289854A1 MANUFACTURING METHOD FOR LIQUID EJECTING HEAD UNIT, AND LIQUID EJECTING APPARATUS Public/Granted day:2010-11-18
Information query
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