Invention Grant
- Patent Title: Anode assembly for electroplating
- Patent Title (中): 用于电镀的阳极组件
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Application No.: US12665687Application Date: 2008-06-20
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Publication No.: US08262873B2Publication Date: 2012-09-11
- Inventor: Jörg Wurm , Stephane Menard , Lothar Schneider
- Applicant: Jörg Wurm , Stephane Menard , Lothar Schneider
- Applicant Address: DE Usinen FR Lyons
- Assignee: Metakem Gesellschaft fur Schichtchemie der Metalle mbH,M. P. C. Micropulse Plating Concepts
- Current Assignee: Metakem Gesellschaft fur Schichtchemie der Metalle mbH,M. P. C. Micropulse Plating Concepts
- Current Assignee Address: DE Usinen FR Lyons
- Agency: McGlinchey Stafford PLLC
- Agent R. Andrew Patty, II
- Priority: EP07012062 20070620
- International Application: PCT/EP2008/057856 WO 20080620
- International Announcement: WO2008/155408 WO 20081224
- Main IPC: C25B11/03
- IPC: C25B11/03 ; C25C7/02

Abstract:
The invention relates to an anode assembly for electroplating comprising (a) an anode body comprising soluble anode material and (b) a shielding covering at least part of the anode body and comprising a self-passivating metal electrically connected to the anode body and allowing electrolyte transport therethrough. The shielding comprises at least one layer of self-passivating metal having no openings larger than 2 mm, preferably 1 mm, in width or the shielding comprises at least two layers of self-passivating metal wherein the openings of at least one layer are at least partially covered by the metal of another layer. The invention also relates to a shielded anode basket, a method for electroplating and the use of the anode assembly and the shielded anode basket.
Public/Granted literature
- US20100206735A1 Anode Assembly For Electroplating Public/Granted day:2010-08-19
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