Invention Grant
- Patent Title: Etchant and method of manufacturing an array substrate using the same
- Patent Title (中): 蚀刻剂和使用其制造阵列基板的方法
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Application No.: US12777532Application Date: 2010-05-11
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Publication No.: US08262928B2Publication Date: 2012-09-11
- Inventor: Bong-Kyun Kim , Jong-Hyun Choung , Byeong-Jin Lee , Sun-Young Hong , Hong-Sick Park , Shi-Yul Kim , Ki-Beom Lee , Sam-Young Cho , Sang-Woo Kim , Hyun-Cheol Shin , Won-Guk Seo
- Applicant: Bong-Kyun Kim , Jong-Hyun Choung , Byeong-Jin Lee , Sun-Young Hong , Hong-Sick Park , Shi-Yul Kim , Ki-Beom Lee , Sam-Young Cho , Sang-Woo Kim , Hyun-Cheol Shin , Won-Guk Seo
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: F. Chau & Associates, LLC
- Priority: KR2009-0042173 20090514
- Main IPC: H01L33/44
- IPC: H01L33/44 ; C09K13/08

Abstract:
An etchant includes about 0.1 percent by weight to about 30 percent by weight of ammonium persulfate (NH4)2S2O8, about 0.1 percent by weight to about 10 percent by weight of an inorganic acid, about 0.1 percent by weight to about 10 percent by weight of an acetate salt, about 0.01 percent by weight to about 5 percent by weight of a fluorine-containing compound, about 0.01 percent by weight to about 5 percent by weight of a sulfonic acid compound, about 0.01 percent by weight to about 2 percent by weight of an azole compound, and a remainder of water. Accordingly, the etchant may have high stability to maintain etching ability. Thus, manufacturing margins may be improved so that manufacturing costs may be reduced.
Public/Granted literature
- US20100291722A1 ETCHANT AND METHOD OF MANUFACTURING AN ARRAY SUBSTRATE USING THE SAME Public/Granted day:2010-11-18
Information query
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