发明授权
US08263308B2 Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation
有权
聚酰亚胺硅酮,含有新型聚酰亚胺硅酮的感光性树脂组合物,以及图案形成方法
- 专利标题: Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation
- 专利标题(中): 聚酰亚胺硅酮,含有新型聚酰亚胺硅酮的感光性树脂组合物,以及图案形成方法
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申请号: US12722068申请日: 2010-03-11
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公开(公告)号: US08263308B2公开(公告)日: 2012-09-11
- 发明人: Shohei Tagami , Takanobu Takeda , Michihiro Sugo , Hideto Kato
- 申请人: Shohei Tagami , Takanobu Takeda , Michihiro Sugo , Hideto Kato
- 申请人地址: JP Tokyo
- 专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: JP2009-058944 20090312
- 主分类号: G03F7/004
- IPC分类号: G03F7/004 ; G03F7/30 ; C08G69/26 ; C08G77/00
摘要:
A polyimide silicone having in the molecule a phenolic hydroxy group in which a part or all of hydrogen atoms are substituted with an acid labile group is provided. The polyimide silicone comprises the unit represented by the formula (1): wherein X is a tetravalent group at least a part of which is a tetravalent organic group represented by the formula (2): wherein R1 is a monovalent hydrocarbon group, R2 is a trivalent group, and n is an integer of 1 to 120 on average; and Y is a divalent organic group at least a part of which is a divalent organic group having a phenolic hydroxy group in which a part or all of hydrogen atoms are substituted with an acid labile group represented by the formula (3): wherein R3 and R4 are a hydrogen atom or an alkyl group, and R5 is an alkyl group, an aryl group, or an aralkyl group. R3 and R4, R3 and R5, or R4 and R5 may be bonded to each other to form a ring together with the carbon atom or the carbon atom and the oxygen atom to which they are bonded with the proviso that the R3, R4, and R5 are independently an alkylene group.
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