Invention Grant
- Patent Title: Wafer level interconnection of inverted metamorphic multijunction solar cells
- Patent Title (中): 倒置变质多结太阳能电池晶圆级互连
-
Application No.: US12187477Application Date: 2008-08-07
-
Publication No.: US08263853B2Publication Date: 2012-09-11
- Inventor: Tansen Varghese
- Applicant: Tansen Varghese
- Applicant Address: US NM Albuquerque
- Assignee: Emcore Solar Power, Inc.
- Current Assignee: Emcore Solar Power, Inc.
- Current Assignee Address: US NM Albuquerque
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L31/042 ; H01L21/302
Abstract:
A method of forming a plurality of discrete, interconnected solar cells mounted on a carrier by providing a first semiconductor substrate; depositing on the first substrate a sequence of layers of semiconductor material forming a solar cell structure; forming a metal back contact layer over the solar cell structure; mounting a carrier on top of the metal back contact; removing the first substrate; and lithographically patterning and etching the solar cell structure to form a plurality of discrete solar cells mounted on the carrier.
Public/Granted literature
- US20100031994A1 Wafer Level Interconnection of Inverted Metamorphic Multijunction Solar Cells Public/Granted day:2010-02-11
Information query
IPC分类:
