Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12837487Application Date: 2010-07-15
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Publication No.: US08263877B2Publication Date: 2012-09-11
- Inventor: Chien-Hung Liu , Po-Chuan Hsieh , Yu-Chang Pai , Shou-Kuo Hsu
- Applicant: Chien-Hung Liu , Po-Chuan Hsieh , Yu-Chang Pai , Shou-Kuo Hsu
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99121635A 20100701
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A printed circuit board includes a first signal layer, a second signal layer, and a dielectric layer sandwiched between the first signal layer and the second signal layer. The first signal layer includes two pads. The second signal layer includes two conducting pieces connected to two signal traces. The shape and material of the pads are the same as the shape and material of the conducting pieces. The projections of the pads on the second signal layer are overlapping with the conducting pieces.
Public/Granted literature
- US20120000700A1 PRINTED CIRCUIT BOARD Public/Granted day:2012-01-05
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