发明授权
- 专利标题： Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
- 专利标题（中）： 半导体器件安装结构及其制造方法，半导体器件安装方法和压制工具
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申请号： US12666860申请日： 2008-06-26
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公开(公告)号： US08264079B2公开(公告)日： 2012-09-11
- 发明人: Teppei Iwase , Yoshihiro Tomura , Kazuhiro Nobori , Yuichiro Yamada , Kentaro Kumazawa
- 申请人： Teppei Iwase , Yoshihiro Tomura , Kazuhiro Nobori , Yuichiro Yamada , Kentaro Kumazawa
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, LLP.
- 优先权： JP2007-169975 20070628
- 国际申请： PCT/JP2008/001669 WO 20080626
- 国际公布： WO2009/001564 WO 20081231
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.