Disclosed is a management method of a mask for exposure utilizing exposure energy information of a wafer. According to the present invention, in case of exposing wafers in exposure apparatuses, information on masks loaded on exposure apparatuses are calculated from the exposure apparatuses, the light energy values applied during the exposure of wafers by the corresponding masks are calculated, the calculated light energy values are stored in the data server, the same data are collected from all wafer exposure processes performed at plural exposure apparatuses within the semiconductor FAB and the exposure information about the exposure energy relating to plural masks used by plural exposure apparatuses are accumulated and managed. Accordingly, the exposure degree of a mask about the exposure energy, as a direct cause of the contamination of masks such as the crystal growth and haze, is directly calculated and then defects of masks are predicted together with measures according that, so that deterioration of the yield of the semiconductor is prevented and the yield of the semiconductor is increased.