发明授权
- 专利标题: Substrate processing apparatus and substrate processing method
- 专利标题(中): 基板加工装置及基板处理方法
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申请号: US12448026申请日: 2007-12-04
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公开(公告)号: US08265787B2公开(公告)日: 2012-09-11
- 发明人: Kojiro Morii
- 申请人: Kojiro Morii
- 申请人地址: JP Osaka
- 专利权人: Sharp Kabushiki Kaisha
- 当前专利权人: Sharp Kabushiki Kaisha
- 当前专利权人地址: JP Osaka
- 代理机构: Edwards Wildman Palmer LLP
- 代理商 David G. Conlin; David A. Tucker
- 优先权: JP2006-327976 20061205
- 国际申请: PCT/JP2007/073399 WO 20071204
- 国际公布: WO2008/069203 WO 20080612
- 主分类号: G06F19/00
- IPC分类号: G06F19/00 ; G06F17/00 ; G05B15/00
摘要:
Based on the positions of a first marker and a second marker of a first substrate placed on a placing surface of a substrate placing table (1), a substrate processing apparatus makes the direction of a line connecting the first marker and the second marker accord with the moving direction of a gantry (2). The positions of the first marker and a third marker, in the state that the direction of the line connecting the first marker and the second marker accord with the moving direction, are stored in a storage section. After a second substrate is placed on the placing surface of the substrate placing table (1), the direction of a line connecting the first marker and the third marker on the second substrate is made to accord with the direction of a line connecting the first marker and the third marker calculated from the position of the third marker and the fourth marker on the first substrate stored in the storage section.
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