发明授权
US08265787B2 Substrate processing apparatus and substrate processing method 失效
基板加工装置及基板处理方法

  • 专利标题: Substrate processing apparatus and substrate processing method
  • 专利标题(中): 基板加工装置及基板处理方法
  • 申请号: US12448026
    申请日: 2007-12-04
  • 公开(公告)号: US08265787B2
    公开(公告)日: 2012-09-11
  • 发明人: Kojiro Morii
  • 申请人: Kojiro Morii
  • 申请人地址: JP Osaka
  • 专利权人: Sharp Kabushiki Kaisha
  • 当前专利权人: Sharp Kabushiki Kaisha
  • 当前专利权人地址: JP Osaka
  • 代理机构: Edwards Wildman Palmer LLP
  • 代理商 David G. Conlin; David A. Tucker
  • 优先权: JP2006-327976 20061205
  • 国际申请: PCT/JP2007/073399 WO 20071204
  • 国际公布: WO2008/069203 WO 20080612
  • 主分类号: G06F19/00
  • IPC分类号: G06F19/00 G06F17/00 G05B15/00
Substrate processing apparatus and substrate processing method
摘要:
Based on the positions of a first marker and a second marker of a first substrate placed on a placing surface of a substrate placing table (1), a substrate processing apparatus makes the direction of a line connecting the first marker and the second marker accord with the moving direction of a gantry (2). The positions of the first marker and a third marker, in the state that the direction of the line connecting the first marker and the second marker accord with the moving direction, are stored in a storage section. After a second substrate is placed on the placing surface of the substrate placing table (1), the direction of a line connecting the first marker and the third marker on the second substrate is made to accord with the direction of a line connecting the first marker and the third marker calculated from the position of the third marker and the fourth marker on the first substrate stored in the storage section.
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