Invention Grant
- Patent Title: Method of optimizing parameters of electronic components on printed circuit boards
- Patent Title (中): 优化印刷电路板上电子元器件参数的方法
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Application No.: US13094807Application Date: 2011-04-26
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Publication No.: US08266574B2Publication Date: 2012-09-11
- Inventor: Hsiao-Yun Su , Ying-Tso Lai , Cheng-Hsien Lee
- Applicant: Hsiao-Yun Su , Ying-Tso Lai , Cheng-Hsien Lee
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99137390A 20101101
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
In a method of optimizing parameters of electronic components on printed circuit boards (PCBs), a first experiment table for m variables of one type of parameter of P electronic components on a PCB is designed using n values of each variable and the RSM. P EHs of each first experiment are obtained by simulating, and P EH empirical formulas are computed according to the P EHs. A second experiment table for the m variables is designed using n′ values of each variable and the full factorial design, and P EHs of each second experiment are computed using the P EH empirical formulas. Experiments, all the P EHs of which are greater than 1, are filtered from the second experiment tables, and an average EH of each filtered experiment is computed to pick an experiment the average EH of which is the greatest. The values of the m variables in the picked experiment are considered as optimized.
Public/Granted literature
- US20120110540A1 METHOD OF OPTIMIZING PARAMETERS OF ELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARDS Public/Granted day:2012-05-03
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