An apparatus is disclosed for aligning socket housing segments for an area array device. Each socket housing segment includes at least a first surface and a second surface, with the second surface opposite the first surface. The second surface of each socket housing segment provides electrical connections for a portion of the area array device. Socket contact pads are disposed on the first surfaces of the plurality of socket housing segments. The socket contact pads correspond to substrate contact pads disposed on a substrate. One or more alignment structures are disposed at a space between the socket housing segments. Each alignment structure is coupled to at least two of the socket housing segments. The one or more alignment structures maintain a predetermined alignment of each socket housing segment so that the socket contact pads align with the substrate contact pads during a surface mount connection process.