发明授权
- 专利标题: Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing
- 专利标题(中): 对准结构具有框架结构和桥接连接以联接和对准插座壳体的段
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申请号: US12783451申请日: 2010-05-19
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公开(公告)号: US08267701B2公开(公告)日: 2012-09-18
- 发明人: Brian S. Beaman , William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer , Yuet-Ying Yu
- 申请人: Brian S. Beaman , William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer , Yuet-Ying Yu
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Kunzler Needham Massey & Thorpe
- 主分类号: H01R12/00
- IPC分类号: H01R12/00
摘要:
An apparatus is disclosed for aligning socket housing segments for an area array device. Each socket housing segment includes at least a first surface and a second surface, with the second surface opposite the first surface. The second surface of each socket housing segment provides electrical connections for a portion of the area array device. Socket contact pads are disposed on the first surfaces of the plurality of socket housing segments. The socket contact pads correspond to substrate contact pads disposed on a substrate. One or more alignment structures are disposed at a space between the socket housing segments. Each alignment structure is coupled to at least two of the socket housing segments. The one or more alignment structures maintain a predetermined alignment of each socket housing segment so that the socket contact pads align with the substrate contact pads during a surface mount connection process.
公开/授权文献
- US20110287638A1 LARGE SCALE HYBRID SOCKET FOR AN AREA ARRAY DEVICE 公开/授权日:2011-11-24
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