Invention Grant
- Patent Title: Thermal module and method for controlling heat-dissipation wind amount thereof
- Patent Title (中): 热模块及其散热风量控制方法
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Application No.: US11270513Application Date: 2005-11-10
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Publication No.: US08267758B2Publication Date: 2012-09-18
- Inventor: Hsiang-Chao Liu
- Applicant: Hsiang-Chao Liu
- Applicant Address: TW Tao Yuan Shien
- Assignee: Quanta Computer Inc.
- Current Assignee: Quanta Computer Inc.
- Current Assignee Address: TW Tao Yuan Shien
- Agency: Rabin & Berdo, P.C.
- Priority: TW94121504A 20050627
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A thermal module and method for controlling heat-dissipation wind amount thereof is provided. The thermal module is figured in an electronic apparatus having a first heat source and a second heat source. The thermal module includes at least a first wind outlet, a second wind outlet and a first wind-amount adjuster. The first wind outlet is for providing a first wind amount to the first heat source while the second wind outlet is for providing a second wind amount to the second heat source. The first wind-amount adjuster, disposed at the first wind outlet, is for adjusting the first wind amount according to temperature of the first heat source and the second heat source.
Public/Granted literature
- US20070017665A1 Thermal module and method for controlling heat-dissipation wind amount thereof Public/Granted day:2007-01-25
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