Invention Grant
US08267758B2 Thermal module and method for controlling heat-dissipation wind amount thereof 有权
热模块及其散热风量控制方法

  • Patent Title: Thermal module and method for controlling heat-dissipation wind amount thereof
  • Patent Title (中): 热模块及其散热风量控制方法
  • Application No.: US11270513
    Application Date: 2005-11-10
  • Publication No.: US08267758B2
    Publication Date: 2012-09-18
  • Inventor: Hsiang-Chao Liu
  • Applicant: Hsiang-Chao Liu
  • Applicant Address: TW Tao Yuan Shien
  • Assignee: Quanta Computer Inc.
  • Current Assignee: Quanta Computer Inc.
  • Current Assignee Address: TW Tao Yuan Shien
  • Agency: Rabin & Berdo, P.C.
  • Priority: TW94121504A 20050627
  • Main IPC: H05K7/20
  • IPC: H05K7/20
Thermal module and method for controlling heat-dissipation wind amount thereof
Abstract:
A thermal module and method for controlling heat-dissipation wind amount thereof is provided. The thermal module is figured in an electronic apparatus having a first heat source and a second heat source. The thermal module includes at least a first wind outlet, a second wind outlet and a first wind-amount adjuster. The first wind outlet is for providing a first wind amount to the first heat source while the second wind outlet is for providing a second wind amount to the second heat source. The first wind-amount adjuster, disposed at the first wind outlet, is for adjusting the first wind amount according to temperature of the first heat source and the second heat source.
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