A packing apparatus includes a case for receiving a plurality of electronic devices and a plurality of mounting members placed in the case. Each mounting member defines a receiving space. A shock-absorbing member is located in the receiving space and divides the receiving space into two mounting spaces. A shock-absorbing block is located in each mounting space. A slot is defined between the shock-absorbing block and the shock-absorbing member. A side of the shock-absorbing block towards the shock-absorbing member defines an oblique plane as a cushioning surface, and the oblique plane abuts the shock-absorbing member when the shock-absorbing member is bent.