发明授权
US08272744B2 LED package having improved light coupling efficiency for an optical system and method of manufacture thereof
有权
具有改进的光学系统的光耦合效率的LED封装及其制造方法
- 专利标题： LED package having improved light coupling efficiency for an optical system and method of manufacture thereof
- 专利标题（中）： 具有改进的光学系统的光耦合效率的LED封装及其制造方法
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申请号： US12200594申请日： 2008-08-28
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公开(公告)号： US08272744B2公开(公告)日： 2012-09-25
- 发明人: Dana F. Segler , Steven M. Penn
- 申请人： Dana F. Segler , Steven M. Penn
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Warren L. Franz; Wade J. Brady, III; Frederick J. Telecky, Jr.
- 主分类号： G03B21/00
- IPC分类号： G03B21/00
摘要：
One aspect of an LED package, which is covered by this disclosure, includes at least two LED emitters located on a substrate wherein each of the at least two LED emitters forms an emitting area. The emitting area is substantially equal to a reflective area of the LED package, and the LED package has an optical axis that is substantially non-parallel to an optical axis of each of the at least two LED emitters.
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