Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US12144680Application Date: 2008-06-24
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Publication No.: US08272826B2Publication Date: 2012-09-25
- Inventor: Cheol Rae Jo , Jang-Wan Park , Won Ki Jeong
- Applicant: Cheol Rae Jo , Jang-Wan Park , Won Ki Jeong
- Applicant Address: KR Seongnam-Si
- Assignee: Advanced Display Process Engineering Co., Ltd
- Current Assignee: Advanced Display Process Engineering Co., Ltd
- Current Assignee Address: KR Seongnam-Si
- Agency: KED & Associates LLP
- Priority: KR10-2007-0078078 20070803
- Main IPC: H01L21/677
- IPC: H01L21/677
Abstract:
A substrate processing apparatus includes first and second transfer chambers, first and second load lock chambers for exchanging one or more substrates with respective ones of first and the second transfer chambers, and a substrate transfer unit, located between the first and second load lock chambers, for transferring the one or more substrates to the first and second load lock chambers.
Public/Granted literature
- US20090035103A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2009-02-05
Information query
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