Invention Grant
US08273233B2 Method to reduce void formation during trapezoidal write pole plating in perpendicular recording
有权
在垂直记录中梯形写入极电镀期间减少空隙形成的方法
- Patent Title: Method to reduce void formation during trapezoidal write pole plating in perpendicular recording
- Patent Title (中): 在垂直记录中梯形写入极电镀期间减少空隙形成的方法
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Application No.: US12460432Application Date: 2009-07-17
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Publication No.: US08273233B2Publication Date: 2012-09-25
- Inventor: Chao-Peng Chen , Jas Chudasama , Situan Lam , Chien-Li Lin
- Applicant: Chao-Peng Chen , Jas Chudasama , Situan Lam , Chien-Li Lin
- Applicant Address: US CA Milpitas
- Assignee: Headway Technologies, Inc.
- Current Assignee: Headway Technologies, Inc.
- Current Assignee Address: US CA Milpitas
- Agency: Saile Ackerman LLC
- Agent Stephen B. Ackerman
- Main IPC: C25D5/02
- IPC: C25D5/02

Abstract:
A method of forming a write pole in a PMR head is disclosed that involves forming an opening in a mold forming layer. A conformal Ru seed layer is formed within the opening and on a top surface. An auxiliary layer made of CoFeNi or alloys thereof is formed as a conformal layer on the seed layer. All or part of the auxiliary layer is removed in an electroplating solution by applying a (−) current or voltage during an activation step that is controlled by activation time. Thereafter, a magnetic material is electroplated with a (+) current to fill the opening and preferably has the same CoFeNi composition as the auxiliary layer. The method avoids Ru oxidation that causes poor adhesion to CoFeNi, and elevated surfactant levels that lead to write pole impurities. Voids in the plated material are significantly reduced by forming a seed layer surface with improved wettability.
Public/Granted literature
- US20110011744A1 Novel method to reduce void formation during trapezoidal write pole plating in perpendicular recording Public/Granted day:2011-01-20
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