Invention Grant
- Patent Title: Release layer materials, substrate structures comprising the same and fabrication method thereof
- Patent Title (中): 剥离层材料,包含其的基底结构及其制造方法
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Application No.: US12608614Application Date: 2009-10-29
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Publication No.: US08273439B2Publication Date: 2012-09-25
- Inventor: Hsueh-Yi Liao , Chyi-Ming Leu , Chun-Wei Su
- Applicant: Hsueh-Yi Liao , Chyi-Ming Leu , Chun-Wei Su
- Applicant Address: TW
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW
- Agency: Lowe Hauptman Ham & Berner, LLP
- Main IPC: B32B7/02
- IPC: B32B7/02 ; B05D5/06

Abstract:
A release layer material of cyclic olefin copolymers (COC) applied in flexible electrical devices represented by Formula (I) or (II) is provided. The invention also provides a substrate structure including the release layer. The substrate structure includes a carrier, a release layer overlying the carrier with one or more blocks with a first area, wherein the release layer includes cyclic olefin copolymers (COC) represented by the disclosed Formula (I) or (II), and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The invention further provides a method for fabricating the substrate structure. In Formula (I) or (II), X is 30-70, X+Y is 100 and R is —H, —CH3 or —C2H5.
Public/Granted literature
- US20100143708A1 RELEASE LAYER MATERIALS, SUBSTRATE STRUCTURES COMPRISING THE SAME AND FABRICATION METHOD THEREOF Public/Granted day:2010-06-10
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