Invention Grant
- Patent Title: Interposers, electronic modules, and methods for forming the same
- Patent Title (中): 内插器，电子模块及其形成方法
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Application No.: US12407252Application Date: 2009-03-19
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Publication No.: US08273603B2Publication Date: 2012-09-25
- Inventor: Livia M. Racz , Gary B. Tepolt , Jeffrey C. Thompson , Thomas A. Langdo , Andrew J. Mueller
- Applicant: Livia M. Racz , Gary B. Tepolt , Jeffrey C. Thompson , Thomas A. Langdo , Andrew J. Mueller
- Applicant Address: US MA Cambridge
- Assignee: The Charles Stark Draper Laboratory, Inc.
- Current Assignee: The Charles Stark Draper Laboratory, Inc.
- Current Assignee Address: US MA Cambridge
- Agency: Goodwin Procter LLP
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01L21/82 ; H01L21/00
Abstract:
In accordance with a method for forming an interposer, a fill hole is formed in a first side of a substrate and a cavity is formed in a second side. The cavity is in fluidic communication with the fill hole. A plurality of posts is formed in the cavity, and an encapsulant is injected through the fill hole into the cavity to encapsulate the plurality of posts. In accordance with a method of thermal management, an electronic component and a heat sink are disposed on opposing sides of an interposer that includes a plurality of encapsulated posts.
Public/Granted literature
- US20090250249A1 INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME Public/Granted day:2009-10-08
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