发明授权
US08273843B2 Organosilicon compound and thermosetting resin composition containing the same
有权
有机硅化合物和含有它们的热固性树脂组合物
- 专利标题： Organosilicon compound and thermosetting resin composition containing the same
- 专利标题（中）： 有机硅化合物和含有它们的热固性树脂组合物
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申请号： US12765215申请日： 2010-04-22
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公开(公告)号： US08273843B2公开(公告)日： 2012-09-25
- 发明人: Akio Tajima , Kazuhiro Yoshida
- 申请人： Akio Tajima , Kazuhiro Yoshida
- 申请人地址： JP Tokyo
- 专利权人： JNC Corporation
- 当前专利权人： JNC Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： J.C. Patents
- 优先权： JP2009-106751 20090424
- 主分类号： C08G77/12
- IPC分类号： C08G77/12
摘要：
An organosilicon compound which is obtained by subjecting a compound (A), a compound (B) and a compound (C) to hydrosilylation reaction: (A) silicone and/or silsesquioxane that has two or more Si—H groups per one molecule and has a molecular weight of 100 to 500,000; (B) silicone and/or silsesquioxane that has two or more alkenyl groups per one molecule and has a molecular weight of 100 to 500,000; and (C) a compound that has one or more epoxy or oxetanyl group and an alkenyl group having 2 to 18 carbon atoms per one molecule.