发明授权
- 专利标题: Substrate surface inspection method and inspection apparatus
- 专利标题(中): 基板表面检查方法和检查装置
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申请号: US12537414申请日: 2009-08-07
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公开(公告)号: US08274047B2公开(公告)日: 2012-09-25
- 发明人: Yoshihiko Naito , Norio Kimura , Kenji Terao , Masahiro Hatakeyama , Masamitsu Itoh
- 申请人: Yoshihiko Naito , Norio Kimura , Kenji Terao , Masahiro Hatakeyama , Masamitsu Itoh
- 申请人地址: JP Tokyo JP Tokyo
- 专利权人: Ebara Corporation,Kabushiki Kaisha Toshiba
- 当前专利权人: Ebara Corporation,Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo JP Tokyo
- 代理机构: Westerman, Hattori, Daniels & Adrian, LLP
- 优先权: JP2008-205097 20080808
- 主分类号: G01N23/00
- IPC分类号: G01N23/00
摘要:
A substrate surface inspection method inspects for a defect on a substrate including a plurality of materials on a surface thereof. The inspection method comprises: irradiating the surface of the substrate with an electron beam, a landing energy of the electron beam set such that a contrast between at least two types of materials of the plurality of materials is within a predetermined range; detecting electrons generated by the substrate to acquire a surface image of the substrate, with a pattern formed thereon from the at least two types of materials eliminated or weakened; and detecting the defect from the acquired surface image by detecting as the defect an object image having a contrast by which the object image can be distinguished from a background image in the surface image. Defects present on the substrate surface can be detected easily and precisely by using a cell inspection.
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