A contact sensitive device (10) comprising a member (12) capable of supporting bending waves, a first sensor (16) mounted on the member for measuring bending wave vibration in the member, the sensor (16) determining a first measured bending wave signal and a processor which calculates information relating to a contact on the member (12) from the measured bending wave signal, the processor applying a correction based on the dispersion relation of the material of the member (12) supporting the bending waves, characterized in that the device (10) comprises a second sensor (16) to determine a second measured bending wave signal which is measured simultaneously with the first measured bending wave signal and the processor calculates a dispersion corrected function of the two measured bending wave signals which is selected from the group consisting of a dispersion corrected correlation function, a dispersion corrected convolution function, a dispersion corrected coherence function and other phase equivalent functions to determine information relating to the contact.