Invention Grant
- Patent Title: Heat conducting apparatus
- Patent Title (中): 导热装置
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Application No.: US12200128Application Date: 2008-08-28
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Publication No.: US08276655B2Publication Date: 2012-10-02
- Inventor: Chung-Jun Chu
- Applicant: Chung-Jun Chu
- Applicant Address: US DE Dover
- Assignee: Chemtron Research LLC
- Current Assignee: Chemtron Research LLC
- Current Assignee Address: US DE Dover
- Agency: Turocy & Watson, LLP
- Priority: TW96217594U 20071019
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20 ; H01L23/34
Abstract:
A heat conducting apparatus adopts a design of two oblique slide blocks disposed between and contacted with two objects for conducting heat from one of the two objects to another. The two oblique slide blocks can be adjusted freely according to the different heights of the two objects to conduct the heat produced by a heat generating component to a heat dissipating structure.
Public/Granted literature
- US20090101324A1 HEAT CONDUCTING APPARATUS Public/Granted day:2009-04-23
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