A fixing frame and an assembled fixing device printing solder paste on a printed circuit board improve an assembly process, cut production costs, and save storage space. The fixing frame has a plurality of fixing portions and a motor unit. The fixing portions are connected to each other to define a hollowed-out planar region. The motor unit generates a plurality of pulling forces by means of mechanical transmission. The assembled fixing device includes a fixing frame and a stencil. The stencil has a solder paste printing region and a plurality of fixing regions. The edge of the solder paste printing region extends outward to define the fixing regions. The fixing regions are movably fixed to the fixing portions and bear the pulling forces. The solder paste printing region lies within the hollowed-out planar region. The directions of the pulling forces are coplanar with the solder paste printing region.