Invention Grant
- Patent Title: Compression molding thickness regulator
- Patent Title (中): 压缩成型厚度调节器
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Application No.: US12612771Application Date: 2009-11-05
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Publication No.: US08277708B2Publication Date: 2012-10-02
- Inventor: David Edwards
- Applicant: David Edwards
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Emerson Thomson Bennett
- Agent Clifford B. Vaterlaus, Esq.
- Main IPC: B29C43/54
- IPC: B29C43/54 ; B29C43/58

Abstract:
Some embodiments comprise a mechanical thickness regulator for a compression mold, or related systems and/or methods. A regulator can include a thickness regulator pin received by a recess in an extendable and retractable relation. The regulator pin can include a tip, or can be contacted with a tip, defining a predetermined distance from the pin to the end of the tip, the distance defining a gap of well known dimensions for receiving and molding polymer melt.
Public/Granted literature
- US20110104320A1 COMPRESSION MOLDING THICKNESS REGULATOR Public/Granted day:2011-05-05
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