发明授权
- 专利标题： Porous films by backfilling with reactive compounds
- 专利标题（中）： 通过反应性化合物回填的多孔膜
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申请号： US13294115申请日： 2011-11-10
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公开(公告)号： US08277899B2公开(公告)日： 2012-10-02
- 发明人: Kevin Krogman , David Olmeijer , Rajul Shah , Benjamin Wang
- 申请人： Kevin Krogman , David Olmeijer , Rajul Shah , Benjamin Wang
- 申请人地址： US CA Sunnyvale
- 专利权人： Svaya Nanotechnologies, Inc.
- 当前专利权人： Svaya Nanotechnologies, Inc.
- 当前专利权人地址： US CA Sunnyvale
- 代理商 Isaac Rutenberg; Richard Aron Osman
- 主分类号： B05D3/02
- IPC分类号： B05D3/02
摘要：
The invention provides methods for modifying one or more properties of porous thin films. In such methods, a formulation comprising a reactive species is applied to the porous thin film and allowed to crosslink. In some embodiments, the crosslinked network thus formed imparts increased mechanical strength and wear resistance to the porous thin films.
公开/授权文献
- US20120148829A1 POROUS FILMS BY BACKFILLING WITH REACTIVE COMPOUNDS 公开/授权日：2012-06-14
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