Invention Grant
- Patent Title: Porous films by backfilling with reactive compounds
- Patent Title (中): 通过反应性化合物回填的多孔膜
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Application No.: US13294115Application Date: 2011-11-10
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Publication No.: US08277899B2Publication Date: 2012-10-02
- Inventor: Kevin Krogman , David Olmeijer , Rajul Shah , Benjamin Wang
- Applicant: Kevin Krogman , David Olmeijer , Rajul Shah , Benjamin Wang
- Applicant Address: US CA Sunnyvale
- Assignee: Svaya Nanotechnologies, Inc.
- Current Assignee: Svaya Nanotechnologies, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Isaac Rutenberg; Richard Aron Osman
- Main IPC: B05D3/02
- IPC: B05D3/02
Abstract:
The invention provides methods for modifying one or more properties of porous thin films. In such methods, a formulation comprising a reactive species is applied to the porous thin film and allowed to crosslink. In some embodiments, the crosslinked network thus formed imparts increased mechanical strength and wear resistance to the porous thin films.
Public/Granted literature
- US20120148829A1 POROUS FILMS BY BACKFILLING WITH REACTIVE COMPOUNDS Public/Granted day:2012-06-14
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