Invention Grant
- Patent Title: Light-emitting element and light-emitting element fabrication method
- Patent Title (中): 发光元件和发光元件的制造方法
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Application No.: US12701743Application Date: 2010-02-08
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Publication No.: US08278667B2Publication Date: 2012-10-02
- Inventor: Michiaki Murata , Shuichi Yamada , Hiroyuki Usami , Takahiro Hashimoto
- Applicant: Michiaki Murata , Shuichi Yamada , Hiroyuki Usami , Takahiro Hashimoto
- Applicant Address: JP Tokyo
- Assignee: Fuji Xerox Co., Ltd.
- Current Assignee: Fuji Xerox Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Fildes & Outland, P.C.
- Priority: JP2009-186820 20090811
- Main IPC: H01L27/15
- IPC: H01L27/15

Abstract:
According to an aspect of the invention, a light-emitting element includes a semiconductor layer, a gold electrode layer, an insulator, a barrier metal layer, and an aluminum wiring layer. The gold electrode layer is formed on a part of the semiconductor layer and is electrically connected to the semiconductor layer. The gold electrode layer being made of metal including gold. The insulator film covers the semiconductor layer and has a contact opening corresponding to the gold electrode layer. The barrier metal layer covers a an upper face of the gold electrode layer and the insulator film in a vicinity of the contact opening. The aluminum wiring layer is formed on the barrier metal layer and electrically connected to the barrier metal layer.
Public/Granted literature
- US20110037093A1 LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING ELEMENT FABRICATION METHOD Public/Granted day:2011-02-17
Information query
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