发明授权
US08278742B2 Thermal enhanced upper and dual heat sink exposed molded leadless package and method
失效
热增强型上，下两个散热片裸露无铅封装及方法
- 专利标题： Thermal enhanced upper and dual heat sink exposed molded leadless package and method
- 专利标题（中）： 热增强型上，下两个散热片裸露无铅封装及方法
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申请号： US13019488申请日： 2011-02-02
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公开(公告)号： US08278742B2公开(公告)日： 2012-10-02
- 发明人: Chung-Lin Wu , Rajeev D. Joshi
- 申请人： Chung-Lin Wu , Rajeev D. Joshi
- 申请人地址： US ME South Portland
- 专利权人： Fairchild Semiconductor Corporation
- 当前专利权人： Fairchild Semiconductor Corporation
- 当前专利权人地址： US ME South Portland
- 代理机构： Hiscock & Barclay, LLP
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/10 ; H01L23/34 ; H01L23/28
摘要：
A semiconductor package includes a semiconductor device 30 and a molded upper heat sink 10. The heat sink has an interior surface 16 that faces the semiconductor device and an exterior surface 15 that is at least partially exposed to the ambient environment of the packaged device. An annular planar base 11 surrounds a raised or protruding central region 12. That region is supported above the plane of the base 11 by four sloped walls 13.1-13.4. The walls slope at an acute angle with respect to the planar annular base and incline toward the center of the upper heat sink 10. Around the outer perimeter of the annular base 11 are four support arms 18.1-18.4. The support arms are disposed at an obtuse angle with respect to the interior surface 16 of the planar annular base 11.
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