Invention Grant
- Patent Title: Electromagnetic relay
- Patent Title (中): 电磁继电器
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Application No.: US12540732Application Date: 2009-08-13
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Publication No.: US08279028B2Publication Date: 2012-10-02
- Inventor: Kenichi Yokoyama , Shigemitsu Aoki
- Applicant: Kenichi Yokoyama , Shigemitsu Aoki
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Component Limited
- Current Assignee: Fujitsu Component Limited
- Current Assignee Address: JP Tokyo
- Agency: Staas & Halsey LLP
- Priority: JP2008-209267 20080815
- Main IPC: H01H9/02
- IPC: H01H9/02 ; H01H13/04

Abstract:
An electromagnetic relay including a body, a plurality of first surface-mount terminals projecting from the body, and at least one second terminal projecting from the body. Each first terminal includes a distal end portion adapted to be mounted on a surface of a circuit board. The second terminal includes a distal end portion adapted to be inserted into a through-hole of a circuit board. The distal end portion of the second terminal is positioned farther away from the body than the distal end portion of the first terminal.
Public/Granted literature
- US20100039196A1 ELECTROMAGNETIC RELAY Public/Granted day:2010-02-18
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