Invention Grant
US08282290B2 Connectors and assemblies having a plurality of moveable mating arrays
有权
具有多个可移动配合阵列的连接器和组件
- Patent Title: Connectors and assemblies having a plurality of moveable mating arrays
- Patent Title (中): 具有多个可移动配合阵列的连接器和组件
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Application No.: US12686484Application Date: 2010-01-13
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Publication No.: US08282290B2Publication Date: 2012-10-09
- Inventor: Robert Neil Mulfinger , Richard Elof Hamner , Jason M'Cheyne Reisinger
- Applicant: Robert Neil Mulfinger , Richard Elof Hamner , Jason M'Cheyne Reisinger
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: G02B6/36
- IPC: G02B6/36 ; H01R13/62

Abstract:
A connector configured to communicatively couple different components. The connector includes a base frame that extends along a longitudinal axis between a pair of frame ends and moveable first and second mating arrays comprising respective mating surfaces having terminals arranged thereon. The connector also includes a coupling mechanism supported by the base frame. The coupling mechanism holds the first and second mating arrays and moves the first and second mating arrays between retracted and engaged positions. The first and second mating arrays are spaced apart from a select component when in the corresponding retracted position. The first and second mating arrays are communicatively coupled to the select component when in the corresponding engaged position. The coupling mechanism initiates movement of the first mating array from the retracted position toward the engaged position while the second mating array remains stationary with respect to the base frame.
Public/Granted literature
- US20110170828A1 CONNECTORS AND ASSEMBLIES HAVING A PLURALITY OF MOVEABLE MATING ARRAYS Public/Granted day:2011-07-14
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