发明授权
- 专利标题: Printed circuit board and manufacturing method thereof
- 专利标题(中): 印刷电路板及其制造方法
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申请号: US12059643申请日: 2008-03-31
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公开(公告)号: US08282841B2公开(公告)日: 2012-10-09
- 发明人: Kanako Nakajima , Masatoshi Inaba , Yoshiharu Unami
- 申请人: Kanako Nakajima , Masatoshi Inaba , Yoshiharu Unami
- 申请人地址: JP Tokyo
- 专利权人: Fujikura Ltd.
- 当前专利权人: Fujikura Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2005-242494 20050824
- 主分类号: B44C1/22
- IPC分类号: B44C1/22
摘要:
A printed circuit board includes a flexible insulated substrate with a first surface and a second surface at both sides respectively, a wiring layer on the first surface, a reinforcement plate on a part of the second surface and an auxiliary layer between the second surface and the reinforcement plate. A reinforcement edge side of the reinforcement plate is located at the outside of an auxiliary edge side of the auxiliary layer.
公开/授权文献
- US20080185362A1 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 公开/授权日:2008-08-07