Invention Grant
US08283040B2 Radiation-curable formulations comprising silica and dispersant and featuring enhanced corrosion control on metal substrates
失效
包含二氧化硅和分散剂的可辐射固化制剂，并具有对金属基材的增强腐蚀控制
- Patent Title: Radiation-curable formulations comprising silica and dispersant and featuring enhanced corrosion control on metal substrates
- Patent Title (中): 包含二氧化硅和分散剂的可辐射固化制剂，并具有对金属基材的增强腐蚀控制
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Application No.: US12520873Application Date: 2007-12-04
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Publication No.: US08283040B2Publication Date: 2012-10-09
- Inventor: Emmanouil Spyrou , Holger Loesch , Pedro Cavaleiro
- Applicant: Emmanouil Spyrou , Holger Loesch , Pedro Cavaleiro
- Applicant Address: DE Essen
- Assignee: Evonik Degussa GmbH
- Current Assignee: Evonik Degussa GmbH
- Current Assignee Address: DE Essen
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: DE102006061380 20061223
- International Application: PCT/EP2007/063205 WO 20071204
- International Announcement: WO2008/077722 WO 20080703
- Main IPC: C08J3/28
- IPC: C08J3/28 ; C09D5/08 ; C09D7/12 ; C09D175/06 ; B32B27/00
Abstract:
The invention relates to silica-containing radiation-curable formulations which in the cured state offer a particular degree of corrosion control for metallic substrates.
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