Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12790883Application Date: 2010-05-31
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Publication No.: US08283571B2Publication Date: 2012-10-09
- Inventor: Ying-Tso Lai , Yung-Chieh Chen , Chun-Jen Chen , Wei-Chieh Chou
- Applicant: Ying-Tso Lai , Yung-Chieh Chen , Chun-Jen Chen , Wei-Chieh Chou
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99116202A 20100520
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A printed circuit board includes a signal layer, a dielectric layer, and a reference layer. The signal layer includes a pair of differential signal lines. The dielectric layer is sandwiched between the signal layer and the reference layer. A first void is defined in the reference layer between projections of the pair of differential signal lines. Two second voids are defined in the reference layer at opposite sides of the projections of the pair of differential signal lines.
Public/Granted literature
- US20110284279A1 PRINTED CIRCUIT BOARD Public/Granted day:2011-11-24
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