Invention Grant
- Patent Title: Modular low stress package technology
- Patent Title (中): 模块化低应力包技术
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Application No.: US12903734Application Date: 2010-10-13
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Publication No.: US08283769B2Publication Date: 2012-10-09
- Inventor: Craig J. Rotay , John Ni , David Lam , David Lee DeWire , John W. Roman , Richard J. Ross
- Applicant: Craig J. Rotay , John Ni , David Lam , David Lee DeWire , John W. Roman , Richard J. Ross
- Applicant Address: US TX Coppell
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: US TX Coppell
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A protective modular package cover has first and second fastening sections located at opposing first and second ends with one or more subassembly receiving sections disposed thereto and is configured to fasten the protective modular package cover to a core. Each fastening section has a foot surface located on a bottom surface of a fastening section and configured to make contact with the core, a mounting hole configured to receive a fastener, and a torque element. Each subassembly receiving section is configured to receive a subassembly and has a cross member formed along the underside of the protective modular package cover. Activation of the first torque element transfers a downward clamping force generated at the fastening element to a top surface of one or more subassemblies disposed in the one or more subassembly receiving sections via the cross member of each of the one or more subassembly receiving sections.
Public/Granted literature
- US20110084371A1 MODULAR LOW STRESS PACKAGE TECHNOLOGY Public/Granted day:2011-04-14
Information query
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