Invention Grant
- Patent Title: Assembled circuit and electronic component
- Patent Title (中): 组装电路和电子元件
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Application No.: US12348105Application Date: 2009-01-02
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Publication No.: US08283789B2Publication Date: 2012-10-09
- Inventor: Jian-Hong Zeng , Wei Yang , Shou-Yu Hong , Jian-Ping Ying
- Applicant: Jian-Hong Zeng , Wei Yang , Shou-Yu Hong , Jian-Ping Ying
- Applicant Address: TW Taoyuan Hsien
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Litron Patent & Trademark Office
- Agent Min-Lee Teng
- Priority: TW97100160A 20080103
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
An assembled circuit comprising an inductive component, a connecting conductor, and a first electronic component is disclosed. The connecting conductor is adapted to wrap a first surface of the inductive component. The first electronic component stacks on the inductive component. The assembled circuit is electrically connected to the carrier via the connecting conductor.
Public/Granted literature
- US20090175014A1 ASSEMBLED CIRCUIT AND ELECTRONIC COMPONENT Public/Granted day:2009-07-09
Information query
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