Invention Grant
- Patent Title: Electronic device
- Patent Title (中): 电子设备
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Application No.: US12691716Application Date: 2010-01-21
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Publication No.: US08283790B2Publication Date: 2012-10-09
- Inventor: Wen-Chieh Tsou
- Applicant: Wen-Chieh Tsou
- Applicant Address: TW New Taipei
- Assignee: Everlight Electronics Co., Ltd.
- Current Assignee: Everlight Electronics Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW98102946A 20090123
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L23/495 ; H01L23/498
Abstract:
An electronic device includes a carrier, a surface mounting device, and solders. The carrier has a plurality of bonding pads, and at least one of the bonding pads has a notch, such that the bonding pad has a necking portion adjacent to the notch. The surface mounting device is disposed on the carrier. Besides, the surface mounting device has a plurality of leads, and each of the leads is connected to the necking portion of one of the bonding pads, respectively. The notch of each of the bonding pads is located under one of the leads. The solders connect the bonding pads and the leads.
Public/Granted literature
- US20100187561A1 ELECTRONIC DEVICE Public/Granted day:2010-07-29
Information query
IPC分类:
