Invention Grant
- Patent Title: Heat-dissipated fastener and elastic frame thereof
- Patent Title (中): 散热紧固件及其弹性框架
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Application No.: US12615934Application Date: 2009-11-10
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Publication No.: US08284555B2Publication Date: 2012-10-09
- Inventor: Cheng-Yu Wang
- Applicant: Cheng-Yu Wang
- Applicant Address: TW Taipei
- Assignee: ASUSTeK Computer Inc.
- Current Assignee: ASUSTeK Computer Inc.
- Current Assignee Address: TW Taipei
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW97145949A 20081127
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A heat-dissipated fastener including a heat-dissipated plate, an elastic frame and a heat sink module is provided. The elastic frame includes a sheet element, multiple connecting ribs and multiple attaching portions. Two elastic arms extend from two corresponding sides of the sheet element, respectively. The attaching portions are located below the sheet element and attached to the heat-dissipated plate. The connecting ribs are connected to the attaching portion and the sheet element, and an accommodating space is formed by the connecting ribs, the sheet element and the heat-dissipated plate to accommodate the heat sink module. When the heat-dissipated plate is attached to the heat source and the elastic arms are bent and fixed to the circuit board of the heat source, the connecting ribs exert force on the heat-dissipated plate vertically, respectively.
Public/Granted literature
- US20100128444A1 HEAT-DISSIPATED FASTENER AND ELASTIC FRAME THEREOF Public/Granted day:2010-05-27
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