Invention Grant
- Patent Title: Systematic method for variable layout shrink
- Patent Title (中): 变量布局收缩的系统方法
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Application No.: US12617046Application Date: 2009-11-12
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Publication No.: US08286119B2Publication Date: 2012-10-09
- Inventor: Fu-Chieh Hsu , Louis Chao-Chiuan Liu , Lee-Chung Lu , Yi-Kan Cheng
- Applicant: Fu-Chieh Hsu , Louis Chao-Chiuan Liu , Lee-Chung Lu , Yi-Kan Cheng
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method for integrated circuit design includes providing a layout of an integrated circuit; determining key parameters of the integrated circuit; determining target values of the key parameters; and performing a first shrinkage of the layout using a first shrink percentage to generate a shrunk layout. The shrunk layout is evaluated by generating values of the key parameters from the shrunk layout. A portion of the values of the key parameters failing to meet respective ones of the target values is found. Guidelines for tuning manufacturing processes of the shrunk layout are provided, so that the portion of the values of the key parameters can meet the respective ones of the target values.
Public/Granted literature
- US20100199238A1 Systematic Method for Variable Layout Shrink Public/Granted day:2010-08-05
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