发明授权
- 专利标题: Apparatus and system for measuring material thickness
- 专利标题(中): 用于测量材料厚度的装置和系统
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申请号: US12434357申请日: 2009-05-01
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公开(公告)号: US08286488B2公开(公告)日: 2012-10-16
- 发明人: Paul Meyer , Jeffrey Anderson , Anand Desai , Wei Luo
- 申请人: Paul Meyer , Jeffrey Anderson , Anand Desai , Wei Luo
- 申请人地址: US NY Schenectady
- 专利权人: General Electric Company
- 当前专利权人: General Electric Company
- 当前专利权人地址: US NY Schenectady
- 代理机构: Global Patent Operation
- 代理商 Mark A. Conklin
- 主分类号: G01B17/02
- IPC分类号: G01B17/02
摘要:
An apparatus and system for measuring material thickness of a test object. In one embodiment, the apparatus can include a measurement probe that can have a plurality of transducer elements that can include transmitter elements and receiver elements arranged, respectively, in on a first side and a second side of a gap. The first side and the second side can form a scan area with at least one active group that can have at least one transmitter element and at least one receiver element, which can be separated from the transmitter element in a spaced relationship.
公开/授权文献
- US20100275692A1 APPARATUS AND SYSTEM FOR MEASURING MATERIAL THICKNESS 公开/授权日:2010-11-04
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