Invention Grant
- Patent Title: Jig for round solder ball attachment
- Patent Title (中): 用于圆焊球附件的夹具
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Application No.: US13233710Application Date: 2011-09-15
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Publication No.: US08286851B2Publication Date: 2012-10-16
- Inventor: Sang Yoon Lee
- Applicant: Sang Yoon Lee
- Applicant Address: KR Suwon, Gyunggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd
- Current Assignee: Samsung Electro-Mechanics Co., Ltd
- Current Assignee Address: KR Suwon, Gyunggi-do
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Priority: KR10-2010-0097772 20101007
- Main IPC: B23K37/00
- IPC: B23K37/00
Abstract:
Disclosed herein is a jig for solder ball attachment capable of sensing whether missing balls occur by electrical sensing using an electrical sensor structure in which a conductive thin film is embedded in the jig and electrically sensing whether abnormal solder balls, for example, large ball/small ball/ball size are attached, without confirming whether abnormal solder balls, for example, large ball/small ball/ball size are attached by vision one by one, thereby shortening operating time and improving workability.
Public/Granted literature
- US20120085810A1 JIG FOR ROUND SOLDER BALL ATTACHMENT Public/Granted day:2012-04-12
Information query
IPC分类:
