发明授权
- 专利标题: Grinding machine and grinding method
- 专利标题(中): 磨床和研磨方法
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申请号: US12578671申请日: 2009-10-14
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公开(公告)号: US08287329B2公开(公告)日: 2012-10-16
- 发明人: Toshihiro Yonezu , Hiroaki Sugiura , Satoshi Ito , Yoshitaro Osaki
- 申请人: Toshihiro Yonezu , Hiroaki Sugiura , Satoshi Ito , Yoshitaro Osaki
- 申请人地址: JP Osaki-shi
- 专利权人: JTekt Corporation
- 当前专利权人: JTekt Corporation
- 当前专利权人地址: JP Osaki-shi
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2008-276538 20081028
- 主分类号: B24B49/00
- IPC分类号: B24B49/00 ; B24B51/00
摘要:
A grinding machine includes: a workhead (22) that rotatably supports a solid cylindrical or hollow cylindrical workpiece (W); a grinding wheel (43) that moves relative to the workhead (22) in a direction that intersects with a rotation axis of the workhead (22) to grind an outer peripheral surface of the workpiece (W); a measuring apparatus (50) that measures a position of an outer peripheral surface of the workpiece (W) corresponding to a rotation angle of the workhead (22); an outer peripheral surface shape calculation unit (64) that calculates an outer peripheral surface shape of the workpiece (W) on the basis of the position of the outer peripheral surface of the workpiece (W) measured by the measuring apparatus (50) during grinding; and a grinding condition determination unit (65) that determines a condition of grinding, which is performed after measurement by the measuring apparatus (50), on the basis of the calculated outer peripheral surface shape of the workpiece (W).
公开/授权文献
- US20100105289A1 GRINDING MACHINE AND GRINDING METHOD 公开/授权日:2010-04-29