发明授权
- 专利标题: Method for producing a gate electrode structure
- 专利标题(中): 栅电极结构的制造方法
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申请号: US12894141申请日: 2010-09-30
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公开(公告)号: US08288230B2公开(公告)日: 2012-10-16
- 发明人: Hans Weber , Stefan Gamerith , Roman Knoefler , Kurt Sorschag , Anton Mauder
- 申请人: Hans Weber , Stefan Gamerith , Roman Knoefler , Kurt Sorschag , Anton Mauder
- 申请人地址: AT Villach
- 专利权人: Infineon Technologies Austria AG
- 当前专利权人: Infineon Technologies Austria AG
- 当前专利权人地址: AT Villach
- 代理机构: Murphy, Bilak & Homiller, PLLC
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A transistor with a gate electrode structure is produced by providing a semiconductor body with a first surface, and with a first sacrificial layer extending in a vertical direction of the semiconductor body from the first surface. A first trench extending from the first surface into the semiconductor body is formed by removing the sacrificial layer in a section adjacent the first surface. A second trench is formed by isotropically etching the semiconductor body in the first trench. A third trench is formed below the second trench by removing at least a part of the first sacrificial layer below the second trench. A dielectric layer is formed which at least covers sidewalls of the third trench and which only covers sidewalls of the second trench. A gate electrode is formed on the dielectric layer in the second trench. The gate electrode and dielectric layer in the second trench form the gate electrode structure.
公开/授权文献
- US20120083081A1 METHOD FOR PRODUCING A GATE ELECTRODE STRUCTURE 公开/授权日:2012-04-05
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