Invention Grant
- Patent Title: Preserving stopband characteristics of electromagnetic bandgap structures in circuit boards
- Patent Title (中): 保持电路板中电磁带隙结构的阻带特性
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Application No.: US12244854Application Date: 2008-10-03
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Publication No.: US08288660B2Publication Date: 2012-10-16
- Inventor: Tae Hong Kim
- Applicant: Tae Hong Kim
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Cynthia G. Seal; Jeffrey L. Streets
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
The stopband characteristics of an electromagnetic bandgap structure in a printed circuit board may be preserved by selectively forming slots in an additional conductive layer of the printed circuit board. For example, an electromagnetic bandgap structure may include a layer with a continuous conductive region and another layer with a periodically patterned region having a plurality of spaced-apart patches interconnected by branches. Additional conductive layers may be included within the printed circuit board without neutralizing the bandgap by forming slots in the conductive layers in general alignment with spaces between the patches.
Public/Granted literature
- US20100084176A1 PRESERVING STOPBAND CHARACTERISTICS OF ELECTROMAGNETIC BANDGAP STRUCTURES IN CIRCUIT BOARDS Public/Granted day:2010-04-08
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