Invention Grant
- Patent Title: LED package having a lead frame
- Patent Title (中): LED封装具有引线框架
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Application No.: US13078497Application Date: 2011-04-01
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Publication No.: US08288793B2Publication Date: 2012-10-16
- Inventor: Do Hyung Kim , Suk Jin Kang
- Applicant: Do Hyung Kim , Suk Jin Kang
- Applicant Address: KR Seoul
- Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2007-0055144 20070605
- Main IPC: H01L33/62
- IPC: H01L33/62
Abstract:
The present invention relates to an LED package including a lead frame including a chip attaching portion with at least one LED chip attached thereto and a plurality of terminal portions each having a width narrower than the chip attaching portion, and a housing for supporting the lead frame. The plurality of terminal portions include at least one first terminal portion extending from a portion of a width of the chip attaching portion, and a plurality of second terminal portions spaced apart from the chip attaching portion.
Public/Granted literature
- US20110180840A1 LED PACKAGE Public/Granted day:2011-07-28
Information query
IPC分类:
