发明授权
- 专利标题： Semiconductor chip package including a lead frame
- 专利标题（中）： 半导体芯片封装包括引线框架
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申请号： US13208115申请日： 2011-08-11
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公开(公告)号： US08288848B2公开(公告)日： 2012-10-16
- 发明人: Nan-Jang Chen
- 申请人： Nan-Jang Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： Mediatek Inc.
- 当前专利权人： Mediatek Inc.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Thomas|Kayden
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/00
摘要：
A semiconductor chip package is provided. The semiconductor chip package includes a lead frame having a chip carrier. A semiconductor chip is mounted on the chip carrier, having a plurality of bonding pads thereon. A package substrate has a cavity therein to accommodate the chip carrier and the semiconductor chip, wherein at least one of the bonding pads of the semiconductor chip is electrically coupled to the package substrate.
公开/授权文献
- US20110291250A1 SEMICONDUCTOR CHIP PACKAGE 公开/授权日：2011-12-01
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